UV After cure OCA


  · TM-Q Series

 

특징


· Easy die-cut
· ​High initial tack
· ​Excellent Ink gap cover
· ​MURA defect control
· ​Hard condition resistance

 

 

용도


· Direct bonding
· TSP / Glass to LCM / OLED display
  (Curing condition : over 1000mj/cm2)

 

 

 


  · TTC-1000 Series

 

특징


· Acid-free
· ​MURA defect control
· ​Hard condition resistance

 

 

용도


· Direct bonding
· TSP / Glass to LCM / OLED display
  ​(Curing condition : over 1000mj/cm2)

 

 

 

 

Rebound Prevention by UV After Curing



 

 

 

Process




Properties



Acid Free Type


 

Environment Properties


 

 

UV After cure Modulus Change


 

 Thickness Line-up